{ "Header": { "GenerationSoftware": { "Vendor": "KiCad", "Application": "Pcbnew", "Version": "8.0.6-8.0.6-0~ubuntu24.04.1" }, "CreationDate": "2024-12-06T14:23:53+02:00" }, "GeneralSpecs": { "ProjectId": { "Name": "stripe_board", "GUID": "73747269-7065-45f6-926f-6172642e6b69", "Revision": "rev?" }, "Size": { "X": 50.1, "Y": 40.1 }, "LayerNumber": 2, "BoardThickness": 1.6, "Finish": "None" }, "DesignRules": [ { "Layers": "Outer", "PadToPad": 0.3, "PadToTrack": 0.3, "TrackToTrack": 0.3, "MinLineWidth": 0.6, "TrackToRegion": 0.3, "RegionToRegion": 0.3 } ], "FilesAttributes": [ { "Path": "stripe_board-F_Cu.gtl", "FileFunction": "Copper,L1,Top", "FilePolarity": "Positive" }, { "Path": "stripe_board-B_Cu.gbl", "FileFunction": "Copper,L2,Bot", "FilePolarity": "Positive" }, { "Path": "stripe_board-F_Adhesive.gta", "FileFunction": "Glue,Top", "FilePolarity": "Positive" }, { "Path": "stripe_board-User_Drawings.gbr", "FileFunction": "Other,User", "FilePolarity": "Positive" }, { "Path": "stripe_board-Edge_Cuts.gm1", "FileFunction": "Profile", "FilePolarity": "Positive" } ], "MaterialStackup": [ { "Type": "Legend", "Name": "Top Silk Screen" }, { "Type": "SolderPaste", "Name": "Top Solder Paste" }, { "Type": "SolderMask", "Thickness": 0.01, "Name": "Top Solder Mask" }, { "Type": "Copper", "Thickness": 0.035, "Name": "F.Cu" }, { "Type": "Dielectric", "Thickness": 1.51, "Material": "FR4", "Name": "F.Cu/B.Cu", "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" }, { "Type": "Copper", "Thickness": 0.035, "Name": "B.Cu" }, { "Type": "SolderMask", "Thickness": 0.01, "Name": "Bottom Solder Mask" }, { "Type": "SolderPaste", "Name": "Bottom Solder Paste" }, { "Type": "Legend", "Name": "Bottom Silk Screen" } ] }